Agustín Fernández León, Head of Microelectronics Section, European Space Agency (ESA/ESTEC), The Netherlands.
Complex integrated circuits such as ASICs, FPGAs or microprocessors are the brains of our satellites. These chips control the behaviour of the instruments on-board and process the data measured by them. They process information received from ground control stations, the send information to Earth. The behaviour and position of the spacecraft is also controlled by these integrated circuits. My talk at DCIS 2022 will present an overview of the evolution and most recent trends of the space microelectronics technology behind this kind of components. The European Space Agency coordinates efforts with all European actors and stakeholders to periodically harmonise space microelectronics R&D roadmaps and the development of new off-the-shelf space microchips. Among them, new European space ASIC platforms using 65/28/22/7 nm silicon processes, radiation hardened reprogrammable FPGAs with embedded processing cores and general purpose rad hard microprocessors. Following on the footsteps of commercial microelectronics trends, space projects are already using ultra-deep submicron technologies, applying AI technology in some payloads and exploring quantum technologies for space applications.
Agustín Fernández León works as Lead Microelectronics Engineer at the European Space Agency (ESA) in the European Space Research and Technology Centre (ESTEC), The Netherlands, since Jan 2022. He has worked 22 years at ESA, the last 20 as Head of the Microelectronics section, providing technical support to ESA missions in the area of ASICs, FPGA and IP Cores design and technology. Before joining ESA, Agustín worked 9 years in Alcatel, Madrid, as digital ASIC designer for telecom applications. He has a MSc in Microelectronics by North Carolina State University and a BSc in Physics by Universidad Complutense de Madrid.
Andreia Cathelin, Technology R&D Fellow, STMicroelectronics, France
This talk will bring the distinguished audience into the IoT land, presenting first the application fields, and then the integration challenges. We will then discuss about the FD-SOI CMOS technologies, and how their particular features permit to tend towards the best-in-class energy efficiency and life time for such products, thanks to this technology opportunity.
Andreia Cathelin (M’04, SM’11) started electrical engineering studies at the Polytechnic Institute of Bucarest, Romania and graduated with MS from the Institut Supérieur d’Electronique du Nord (ISEN), Lille, France in 1994. In 1998 and 2013 respectively, she received PhD and “habilitation à diriger des recherches” (French highest academic degree) from the Université de Lille 1, France.
Since 1998, she has been with STMicroelectronics, Crolles, France, now Technology R&D Fellow. Her focus areas are in the design of RF/mmW/THz and ultra-low-power circuits and systems. She is leading and driving research in advanced topics inside the company R&D program and through leadership cooperation with major universities around the world.
Andreia is very active in the IEEE community since more than 15 years, strongly implied with SSCS and its Adcom, the Executive Committee of VLSI Symposium and has been the TPC chair of ESSCIRC 2020 and 2021 in Grenoble. She has been for 10 years involved with ISSCC as RF subcommittee chair and then member of the Executive Committee. She is as well a founding member of the IEEE SSCS Women in Circuits group.
Andreia has authored or co-authored 150+ technical papers and 14 book chapters, has co-edited the Springer book “The Fourth Terminal, Benefits of Body-Biasing Techniques for FDSOI Circuits and Systems” and has filed more than 25 patents.
Andreia is a co-recipient of the ISSCC 2012 Jan Van Vessem Award for Outstanding European Paper, the ISSCC 2013 Jack Kilby Award for Outstanding Student Paper and the RFIC2021 Best Industry Paper Award. She is as well the winner of the 2012 STMicroelectronics Technology Council Innovation Prize, for having introduced on the company’s roadmap the integrated CMOS THz technology for imaging applications.
Very recently, Andreia has been awarded an Honorary Doctorate from the University of Lund, Sweden, promotion of 2020.