Proceedings of the 2016 IEEE CPMT Symposium Japan (ICSJ 2016). 7-9 November 2016

Chapter title

   Towards A Common Integration Platform For Photonics and Electronics. Challenges For Assembly and Packaging

Pages:

   115 to 117

Authors

   Ederra Urzainqui, Iñigo

Publishing house

   Institute of Electrical and Electronics Engineers ( IEEE )

Publisher

   

Place

   Desconocida (Estados Unidos de América)

Year

   2016

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